GB/T 24578-2015
AbolishedTest method for measuring surface metal contamination on silicon wafers by total reflection X-Ray fluorescence spectroscopy
硅片表面金属沾污的全反射X光荧光光谱测试方法
Application Summary AI generated
This standard specifies a test method for measuring trace metal contamination on the surface of silicon wafers using total reflection X-ray fluorescence spectroscopy. It is applied in the semiconductor manufacturing industry for quality control and process monitoring of silicon wafer cleanliness. The method is used to detect metallic impurities at ultra-trace levels, ensuring wafer integrity for integrated circuit fabrication.
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